MediaTek Dimensity 8000 kontra Qualcomm Snapdragon 7 Gen 1. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Dimensity Qualcomm Snapdragon
• Grupa CPU
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• Segment
  Mobile Mobile
• Pokolenie
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  Nie Nie
• Overclocking
  Nie Nie
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G610 MP6 brak iGPU
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  6
• Max. displays
  1
• Pokolenie
  Vallhall 3
• Direct X
  12 --
• Proces technologiczny
  4 nm
• Data wydania
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nie
• h265 / HEVC (10 bit)
  Decode / Encode Nie
• h264
  Decode / Encode Nie
• VP8
  Decode / Encode Nie
• VP9
  Decode / Encode Nie
• AV1
  Decode Nie
• AVC
  Decode / Encode Nie
• VC-1
  Decode / Encode Nie
• JPEG
  Decode / Encode Nie

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 oraz MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR5-6400 LPDDR5-6400
• Max. Pamięć
  16 GB
• Kanały pamięci
  4 4
• ECC
  Nie Nie
• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 oraz Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 oraz Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architektura
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• Proces technologiczny
  5 nm 4 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)