MediaTek Dimensity 8000 contre Qualcomm Snapdragon 7 Gen 1. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek Dimensity Qualcomm Snapdragon
• Groupe de CPU
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• Segment
  Mobile Mobile
• Génération
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• Architecture de base
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  Non Non
• Overclocking
  Non Non
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-G610 MP6 pas d'iGPU
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  6
• Max. displays
  1
• Génération
  Vallhall 3
• Direct X
  12 --
• Processus technologique
  4 nm
• Date de sortie
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Non
• h265 / HEVC (10 bit)
  Decode / Encode Non
• h264
  Decode / Encode Non
• VP8
  Decode / Encode Non
• VP9
  Decode / Encode Non
• AV1
  Decode Non
• AVC
  Decode / Encode Non
• VC-1
  Decode / Encode Non
• JPEG
  Decode / Encode Non

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 et MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR5-6400 LPDDR5-6400
• Max. Mémoire
  16 GB
• Canaux de mémoire
  4 4
• ECC
  Non Non
• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 et Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 et Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• Processus technologique
  5 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)