MediaTek Dimensity 8000 gegen Qualcomm Snapdragon 7 Gen 1. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• Segment
  Mobile Mobile
• Generation
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  Nein Nein
• Übertaktung
  Nein Nein
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G610 MP6 keine iGPU
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  6
• Max. displays
  1
• Generation
  Vallhall 3
• Direct X
  12 --
• technisches verfahren
  4 nm
• Datum der Veröffentlichung
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nein
• h265 / HEVC (10 bit)
  Decode / Encode Nein
• h264
  Decode / Encode Nein
• VP8
  Decode / Encode Nein
• VP9
  Decode / Encode Nein
• AV1
  Decode Nein
• AVC
  Decode / Encode Nein
• VC-1
  Decode / Encode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 und MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR5-6400 LPDDR5-6400
• Max. Speicher
  16 GB
• Speicherkanäle
  4 4
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 und Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 und Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architektur
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• technisches verfahren
  5 nm 4 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)