MediaTek Dimensity 8000 vs Qualcomm Snapdragon 7 Gen 1. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Mediatek Dimensity Qualcomm Snapdragon
• CPU 그룹
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• 세그먼트
  Mobile Mobile
• 세대
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  아니요 아니요
• 오버클러킹
  아니요 아니요
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G610 MP6 iGPU 없음
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  6
• Max. displays
  1
• 세대
  Vallhall 3
• Direct X
  12 --
• 기술
  4 nm
• 릴리스 날짜
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode 아니요
• h265 / HEVC (10 bit)
  Decode / Encode 아니요
• h264
  Decode / Encode 아니요
• VP8
  Decode / Encode 아니요
• VP9
  Decode / Encode 아니요
• AV1
  Decode 아니요
• AVC
  Decode / Encode 아니요
• VC-1
  Decode / Encode 아니요
• JPEG
  Decode / Encode 아니요

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 그리고 MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR5-6400 LPDDR5-6400
• 최대. Memory
  16 GB
• 메모리 채널
  4 4
• ECC
  아니요 아니요
• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 그리고 Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 그리고 Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• 아키텍처
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• 기술
  5 nm 4 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)