MediaTek Dimensity 8000 対 Qualcomm Snapdragon 7 Gen 1. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Mediatek Dimensity Qualcomm Snapdragon
• CPUグループ
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• セグメント
  Mobile Mobile
• 世代
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G610 MP6 iGPUなし
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  6
• Max. displays
  1
• 世代
  Vallhall 3
• Direct X
  12 --
• ぎじゅつてきなかだい
  4 nm
• 発売日
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode いいえ
• h265 / HEVC (10 bit)
  Decode / Encode いいえ
• h264
  Decode / Encode いいえ
• VP8
  Decode / Encode いいえ
• VP9
  Decode / Encode いいえ
• AV1
  Decode いいえ
• AVC
  Decode / Encode いいえ
• VC-1
  Decode / Encode いいえ
• JPEG
  Decode / Encode いいえ

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 と MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR5-6400 LPDDR5-6400
• マックス メモリ
  16 GB
• メモリーチャンネル
  4 4
• ECC
  いいえ いいえ
• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 と Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 と Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• 建築
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• ぎじゅつてきなかだい
  5 nm 4 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)