MediaTek Dimensity 8000 contra Qualcomm Snapdragon 7 Gen 1. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity Qualcomm Snapdragon
• Grupo CPU
  MediaTek Dimensity 8000 Qualcomm Snapdragon 7/8 Gen 1
• Segmento
  Mobile Mobile
• Generación
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 6 / 6
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x
• B-Core
  4x Cortex-A55 2x
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.00 GHz (2.75 GHz) 3.20 GHz
• B-Core Frequency
  -- 2.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G610 MP6 sin iGPU
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  6
• Max. displays
  1
• Generación
  Vallhall 3
• Direct X
  12 --
• Proceso técnico
  4 nm
• Fecha de publicación
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7 Gen 1 y MediaTek Dimensity 8000. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR5-6400 LPDDR5-6400
• Max. Memoria
  16 GB
• Canales de memoria
  4 4
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 8000 y Qualcomm Snapdragon 7 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 8000 y Qualcomm Snapdragon 7 Gen 1, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Arquitectura
  Cortex-A78 / Cortex-A55 Cortex-X2 / -A710 / -A510
• Proceso técnico
  5 nm 4 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2022 Q2/2022
• Part Number
  -- SM8475
• Operating systems
  Android Android, Windows 10 (ARM)