Qualcomm Snapdragon 7c Plus Gen 3 gegen Qualcomm Snapdragon 8 Gen 1. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU Gruppe
  Qualcomm Snapdragon 7c Plus Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Generation
  3 1
• Vergangenes Modell
  Qualcomm Snapdragon 7c Gen 2 Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x Cortex-X2
• B-Core
  4x Cortex-A55 3x Cortex-A710
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Unbekannt Qualcomm Adreno 730
• GPU frequency
  0.70 GHz 0.84 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Generation
  7
• Direct X
  -- 12.1
• technisches verfahren
  4 nm
• Datum der Veröffentlichung
  Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 und Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-4266LPDDR5-6400 LPDDR5-3200
• Max. Speicher
  16 GB
• Speicherkanäle
  2 4
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 und Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 und Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architektur
  Cortex-A78 / Cortex-A55 Kryo
• technisches verfahren
  6 nm 4 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2022 Q1/2022
• Part Number
  -- SM8450