Qualcomm Snapdragon 7c Plus Gen 3 contre Qualcomm Snapdragon 8 Gen 1. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Groupe de CPU
  Qualcomm Snapdragon 7c Plus Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Génération
  3 1
• Modèle précédent
  Qualcomm Snapdragon 7c Gen 2 Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Architecture de base
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x Cortex-X2
• B-Core
  4x Cortex-A55 3x Cortex-A710
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Inconnu Qualcomm Adreno 730
• GPU frequency
  0.70 GHz 0.84 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Génération
  7
• Direct X
  -- 12.1
• Processus technologique
  4 nm
• Date de sortie
  Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Non Decode / Encode
• VP8
  Non Decode / Encode
• VP9
  Non Decode / Encode
• AV1
  Non Non
• AVC
  Non Decode
• VC-1
  Non Decode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 et Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-4266LPDDR5-6400 LPDDR5-3200
• Max. Mémoire
  16 GB
• Canaux de mémoire
  2 4
• ECC
  Non Non
• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 et Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 et Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architecture
  Cortex-A78 / Cortex-A55 Kryo
• Processus technologique
  6 nm 4 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q1/2022 Q1/2022
• Part Number
  -- SM8450