Qualcomm Snapdragon 7c Plus Gen 3 kontra Qualcomm Snapdragon 8 Gen 1. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Grupa CPU
  Qualcomm Snapdragon 7c Plus Qualcomm Snapdragon 8 Gen 1
• Segment
  Mobile Mobile
• Pokolenie
  3 1
• Model z przeszłości
  Qualcomm Snapdragon 7c Gen 2 Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x Cortex-X2
• B-Core
  4x Cortex-A55 3x Cortex-A710
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Nieznany Qualcomm Adreno 730
• GPU frequency
  0.70 GHz 0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Pokolenie
  7
• Direct X
  -- 12.1
• Proces technologiczny
  4 nm
• Data wydania
  Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 oraz Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-4266LPDDR5-6400 LPDDR5-3200
• Max. Pamięć
  16 GB
• Kanały pamięci
  2 4
• ECC
  Nie Nie
• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 oraz Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 oraz Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• Architektura
  Cortex-A78 / Cortex-A55 Kryo
• Proces technologiczny
  6 nm 4 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2022 Q1/2022
• Part Number
  -- SM8450