Qualcomm Snapdragon 7c Plus Gen 3 gegen Intel Core i5-4200U. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Intel Core i5
• CPU Gruppe
  Qualcomm Snapdragon 7c Plus Intel Core i 4000U
• Segment
  Mobile Mobile
• Generation
  3 4
• Vergangenes Modell
  Qualcomm Snapdragon 7c Gen 2 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) normal
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Unbekannt Intel HD Graphics 4400
• GPU frequency
  0.70 GHz 0.20 GHz
• GPU (Turbo)
  kein Turbo 1.00 GHz
• Ausführungseinheiten
  0 20
• Shader
  0 160
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 3
• Generation
  7.5
• technisches verfahren
  22 nm
• Datum der Veröffentlichung
  Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Nein Decode / Encode
• VP8
  Nein Nein
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode
• JPEG
  Nein Decode

Overview of the types and quantities of RAM supported by Intel Core i5-4200U und Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-4266LPDDR5-6400 DDR3L-1600 SO-DIMM
• Speicherkanäle
  2 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 und Intel Core i5-4200U to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 und Intel Core i5-4200U, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA-Erweiterungen
  SSE4.1, SSE4.2, AVX2
• L3-Cache
  -- 3.00 MB
• Architektur
  Cortex-A78 / Cortex-A55 Haswell U
• technisches verfahren
  6 nm 22 nm
• Virtualisierung
  None VT-x, VT-x EPT, VT-d
• Steckdose
  N/A BGA 1168
• Datum der Veröffentlichung
  Q1/2022 Q3/2013