Qualcomm Snapdragon 7c Plus Gen 3 vs Qualcomm Snapdragon 8 Gen 1. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU 그룹
  Qualcomm Snapdragon 7c Plus Qualcomm Snapdragon 8 Gen 1
• 세그먼트
  Mobile Mobile
• 세대
  3 1
• 이전 버전
  Qualcomm Snapdragon 7c Gen 2 Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A78 1x Cortex-X2
• B-Core
  4x Cortex-A55 3x Cortex-A710
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  알 수 없음 Qualcomm Adreno 730
• GPU frequency
  0.70 GHz 0.84 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 세대
  7
• Direct X
  -- 12.1
• 기술
  4 nm
• 릴리스 날짜
  Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  아니요 Decode / Encode
• h265 / HEVC (10 bit)
  아니요 Decode / Encode
• h264
  아니요 Decode / Encode
• VP8
  아니요 Decode / Encode
• VP9
  아니요 Decode / Encode
• AV1
  아니요 아니요
• AVC
  아니요 Decode
• VC-1
  아니요 Decode
• JPEG
  아니요 Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 그리고 Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-4266LPDDR5-6400 LPDDR5-3200
• 최대. Memory
  16 GB
• 메모리 채널
  2 4
• ECC
  아니요 아니요
• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 그리고 Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 그리고 Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 4.00 MB
• 아키텍처
  Cortex-A78 / Cortex-A55 Kryo
• 기술
  6 nm 4 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2022 Q1/2022
• Part Number
  -- SM8450