Qualcomm Snapdragon 7c Plus Gen 3 gegen Apple M1. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Apple M series
• CPU Gruppe
  Qualcomm Snapdragon 7c Plus Apple M1
• Segment
  Mobile Mobile
• Generation
  3 1
• Vergangenes Modell
  Qualcomm Snapdragon 7c Gen 2 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Unbekannt Apple M1 (8 Core)
• GPU frequency
  0.70 GHz 3.20 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  0 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• Generation
  1
• technisches verfahren
  5 nm
• Datum der Veröffentlichung
  Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Nein Decode / Encode
• VP8
  Nein Decode
• VP9
  Nein Decode / Encode
• AV1
  Nein Decode
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 und Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-4266LPDDR5-6400 LPDDR4X-4266
• Max. Speicher
  16 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 und Apple M1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP up
  -- 20 W
• TDP down
  -- 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 und Apple M1, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  Rosetta 2 x86-Emulation
• L2-Cache
  -- 16.00 MB
• Architektur
  Cortex-A78 / Cortex-A55 M1
• technisches verfahren
  6 nm 5 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2022 Q4/2020