Qualcomm Snapdragon 7c Plus Gen 3 contra Apple M1. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Apple M series
• Grupo CPU
  Qualcomm Snapdragon 7c Plus Apple M1
• Segmento
  Mobile Mobile
• Generación
  3 1
• Modelo anterior
  Qualcomm Snapdragon 7c Gen 2 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Desconocido Apple M1 (8 Core)
• GPU frequency
  0.70 GHz 3.20 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  0 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• Generación
  1
• Proceso técnico
  5 nm
• Fecha de publicación
  Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP8
  No Decode
• VP9
  No Decode / Encode
• AV1
  No Decode
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 y Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-4266LPDDR5-6400 LPDDR4X-4266
• Max. Memoria
  16 GB
• Canales de memoria
  2 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 y Apple M1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP up
  -- 20 W
• TDP down
  -- 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 y Apple M1, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensiones ISA
  Rosetta 2 x86-Emulation
• L2-Cache
  -- 16.00 MB
• Arquitectura
  Cortex-A78 / Cortex-A55 M1
• Proceso técnico
  6 nm 5 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2022 Q4/2020