Qualcomm Snapdragon 7c Plus Gen 3 versus Apple M1. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Apple M series
• Grupo CPU
  Qualcomm Snapdragon 7c Plus Apple M1
• Segmento
  Mobile Mobile
• Geração
  3 1
• Modelo passado
  Qualcomm Snapdragon 7c Gen 2 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Desconhecido Apple M1 (8 Core)
• GPU frequency
  0.70 GHz 3.20 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  0 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• Geração
  1
• Processo técnico
  5 nm
• Data de lançamento
  Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Não Decode / Encode
• h265 / HEVC (10 bit)
  Não Decode / Encode
• h264
  Não Decode / Encode
• VP8
  Não Decode
• VP9
  Não Decode / Encode
• AV1
  Não Decode
• AVC
  Não Decode
• VC-1
  Não Decode
• JPEG
  Não Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 e Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-4266LPDDR5-6400 LPDDR4X-4266
• Máx. Memória
  16 GB
• Canais de memória
  2 2
• ECC
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 e Apple M1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP up
  -- 20 W
• TDP down
  -- 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 e Apple M1, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensões ISA
  Rosetta 2 x86-Emulation
• Кеш L2
  -- 16.00 MB
• Arquitectura
  Cortex-A78 / Cortex-A55 M1
• Processo técnico
  6 nm 5 nm
• Virtualização
  None None
• Socket
  N/A N/A
• Data de lançamento
  Q1/2022 Q4/2020