Qualcomm Snapdragon 7c Plus Gen 3 kontra Apple M1. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Apple M series
• Grupa CPU
  Qualcomm Snapdragon 7c Plus Apple M1
• Segment
  Mobile Mobile
• Pokolenie
  3 1
• Model z przeszłości
  Qualcomm Snapdragon 7c Gen 2 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Nieznany Apple M1 (8 Core)
• GPU frequency
  0.70 GHz 3.20 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 128
• Max. GPU Memory
  -- 8 GB
• Max. displays
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• Pokolenie
  1
• Proces technologiczny
  5 nm
• Data wydania
  Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP8
  Nie Decode
• VP9
  Nie Decode / Encode
• AV1
  Nie Decode
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Apple M1 oraz Qualcomm Snapdragon 7c Plus Gen 3. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-4266LPDDR5-6400 LPDDR4X-4266
• Max. Pamięć
  16 GB
• Kanały pamięci
  2 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Plus Gen 3 oraz Apple M1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP up
  -- 20 W
• TDP down
  -- 10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Plus Gen 3 oraz Apple M1, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Rozszerzenia ISA
  Rosetta 2 x86-Emulation
• L2-Cache
  -- 16.00 MB
• Architektura
  Cortex-A78 / Cortex-A55 M1
• Proces technologiczny
  6 nm 5 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2022 Q4/2020