HiSilicon Kirin 810 versus Qualcomm Snapdragon 665. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Geração
  6 7
• Grupo CPU
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.90 GHz 1.80 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.20 GHz 2.00 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.80 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 4x Kryo 260 Gold
• B core
  6x Cortex-A55 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G52 MP6 Qualcomm Adreno 610
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  16 0
• Shader
  288 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 0
• Geração
  Bifrost 2 6
• DirectX Version
  12 12.1
• Processo técnico
  12 nm 11 nm
• Data de lançamento
  Q1/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Não Não
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 665 e HiSilicon Kirin 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-2133 LPDDR3-1866LPDDR4X-1866
• Máx. Memória
  6 GB
• ECC
  Não Não
• Canais de memória
  4 2

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 810 e Qualcomm Snapdragon 665 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 810 e Qualcomm Snapdragon 665, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L3
  1.00 MB --
• Arquitectura
  Cortex-A76 / Cortex-A55 Kryo 260
• Processo técnico
  7 nm 11 nm
• Socket
  N/A N/A
• Data de lançamento
  Q2/2019 Q2/2019
• Part Number
  -- SM6125