HiSilicon Kirin 810
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Pontuação geral
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Lançado
Q2/2019
HiSilicon Kirin 810

Processador HiSilicon Kirin 810, especificações e padrões de referência

1732 lugar no ranking geral das CPUs!
O processador HiSilicon Kirin 810 é instalado em placas com socket N/A e opera a uma frequência de 1.90 GHz. O HiSilicon Kirin 810 possui um total de 8 núcleos. Data de lançamento: Q2/2019. TDP é 5 W. Esta análise fornece todas as especificações técnicas e dados detalhados sobre o processador HiSilicon Kirin 810. Descubra tudo para saber se o jogo ou software funcionará no HiSilicon Kirin 810.

Especificações

Dados técnicos
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segmento
    Mobile
  • Série
  • Geração
    6
  • Grupo CPU
    HiSilicon Kirin 810/820
  • Modelo passado
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 810. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequência
    1.90 GHz
  • Núcleos de CPU
    8
  • Turbo (1 núcleo)
    2.20 GHz
  • Roscas de CPU
    8
  • Turbo (8 Cores)
    2.20 GHz
  • Hyperthreading
    Não
  • Overclocking
    Não
  • Arquitectura central
    hybrid (big.LITTLE)
  • A core
    2x Cortex-A76
  • B core
    6x Cortex-A55
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nome da GPU
    ARM Mali-G52 MP6
  • GPU frequency
    0.85 GHz
  • GPU (Turbo)
    Sem turbo
  • Unidades de execução
    16
  • Shader
    288
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Geração
    Bifrost 2
  • DirectX Version
    12
  • Processo técnico
    12 nm
  • Data de lançamento
    Q1/2018
Suporte de codec de hardware

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Não
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Tipo de memória
    LPDDR4X-2133
  • Máx. Memória
    6 GB
  • ECC
    Não
  • Canais de memória
    4
  • Versão PCIe
  • Pistas PCIe
Criptografia

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Não
Consumo de energia
  • TDP (PL1)
    5 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura máxima
    --
* ver abaixo
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Conjunto de instruções (ISA)
    ARMv8-A64 (64 bit)
  • Virtualização
    None
  • Extensões ISA
  • Кеш L2
    --
  • Кеш L3
    1.00 MB
  • Arquitectura
    Cortex-A76 / Cortex-A55
  • Processo técnico
    7 nm
  • Socket
    N/A
  • Data de lançamento
    Q2/2019
  • Part Number
    --
Posições em todos os rankings

Posições comuns HiSilicon Kirin 810 CPU em padrões de referência populares, para comparação com outros modelos.

  • Geekbench 5, 64bit (Single-Core)
    1036 place
  • Geekbench 5, 64bit (Multi-Core)
    970 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1435 place

Benchmarks

Testes de desempenho CPU

Compare the benchmark scores of HiSilicon Kirin 810 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
O Geekbench 5 SC é um popular teste de desempenho transversal para processadores de secretária ou móveis que utilizam intensivamente a memória do sistema.
Geekbench 5, 64bit (Multi-Core)
O Geekbench 5 MC é um popular teste de desempenho transversal para processadores desktop ou móveis que utilizam intensivamente a memória do sistema.
1975
1965
1953
1951
HiSilicon Kirin 810
iGPU - FP32 Performance (Single-precision GFLOPS)
O desempenho do iGPU - o GPU interno em jogos.
160
160
160
157
HiSilicon Kirin 810

Sinónimos

Processadores semelhantes em termos de desempenho.

Similar em processadores de dados técnicos com HiSilicon Kirin 810.

Intel Core 2 Extreme QX9650 Ver
Intel Atom E3845 Ver
Intel Atom Z3775D Ver
Intel Atom Z3775 Ver
MediaTek Helio P23 Ver
AMD E2-1800 Ver
AMD E2-3000 Ver
AMD E1-2500 Ver

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 810

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