HiSilicon Kirin 810 対 Qualcomm Snapdragon 665. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  HiSilicon Kirin Qualcomm Snapdragon
• 世代
  6 7
• CPUグループ
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.90 GHz 1.80 GHz
• CPUコア
  8 8
• ターボ(1コア)
  2.20 GHz 2.00 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.80 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 4x Kryo 260 Gold
• B core
  6x Cortex-A55 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G52 MP6 Qualcomm Adreno 610
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  16 0
• シェーダー
  288 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 0
• 世代
  Bifrost 2 6
• DirectX Version
  12 12.1
• ぎじゅつてきなかだい
  12 nm 11 nm
• 発売日
  Q1/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  いいえ いいえ
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 665 と HiSilicon Kirin 810. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-2133 LPDDR3-1866LPDDR4X-1866
• マックス メモリ
  6 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 2

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 810 と Qualcomm Snapdragon 665 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 810 と Qualcomm Snapdragon 665, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• L3-Cache
  1.00 MB --
• 建築
  Cortex-A76 / Cortex-A55 Kryo 260
• ぎじゅつてきなかだい
  7 nm 11 nm
• ソケット
  N/A N/A
• 発売日
  Q2/2019 Q2/2019
• Part Number
  -- SM6125