Qualcomm Snapdragon 810 kontra HiSilicon Kirin 960. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon HiSilicon Kirin
• Grupa CPU
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Pokolenie
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Częstotliwość
  1.50 GHz 1.80 GHz
• Turbo (1 rdzeń)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz No turbo
• Jednostki wykonawcze
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• Pokolenie
  4 Bifrost 1
• Proces technologiczny
  20 nm 16 nm
• Data wydania
  Q2/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Decode Nie
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 oraz Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4-1600 LPDDR4-1600
• Max. Pamięć
  6 GB
• Kanały pamięci
  2 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 oraz HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 oraz HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• Architektura
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Proces technologiczny
  20 nm 16 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --