Qualcomm Snapdragon 810
HiSilicon Kirin 960
选择视频卡1
选择视频卡2

Qualcomm Snapdragon 810 对 HiSilicon Kirin 960. 规格、性能、测试

总分
star star star star star
已发布
Q3/2014
Qualcomm Snapdragon 810
Qualcomm Snapdragon 810
已发布
Q4/2016
总分
star star star star star
HiSilicon Kirin 960
HiSilicon Kirin 960

比较 Qualcomm Snapdragon 810 VS HiSilicon Kirin 960. Which processor delivers superior performance?

In this detailed comparison, we evaluate the specifications and benchmarks of both processors to determine the best choice for your needs. We analyze their core counts, maximum frequencies, and power consumption.

Qualcomm Snapdragon 810 boasts a maximum frequency of 1.50 GHz GHz. 8 / 8 cores that enhance multitasking capabilities.发布于 Q3/2014, it incorporates the latest technology for optimal efficiency.

HiSilicon Kirin 960 features a maximum frequency of 1.80 GHz GHz. 8 cores designed for high-performance tasks.Its power consumption is 5 W W, providing a balance of power and efficiency.Launched in Q4/2016, it is built to handle demanding applications.

差异

  • 在总排名中的位置

    (基于几个基准)

    1784 left arrow score

所有排名中的位置

共同立场 Qualcomm Snapdragon 810 在流行的基准测试中的CPU,用于与其他型号进行比较.

  • Geekbench 5, 64bit (Single-Core)
    1404 place
  • Geekbench 5, 64bit (Multi-Core)
    1441 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    918 place
  • 在总排名中的位置

    (基于几个基准)

    1762 left arrow score
  • 更高的时钟速度

    左右 17% 更好的时钟速度

    1.80 GHz left arrow 1.50 GHz
  • 更高的涡轮增压时钟速度

    左右 17 超频后的时钟速度提高了%

    2.40 GHz left arrow 2.00 GHz

所有排名中的位置

共同立场 HiSilicon Kirin 960 在流行的基准测试中的CPU,用于与其他型号进行比较.

  • Geekbench 5, 64bit (Single-Core)
    1260 place
  • Geekbench 5, 64bit (Multi-Core)
    1098 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1253 place

规格

技术数据
Qualcomm Snapdragon 810 Qualcomm Snapdragon 810
HiSilicon Kirin 960 HiSilicon Kirin 960
CPU家族和团体

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

  • 系列
    Qualcomm Snapdragon left arrow HiSilicon Kirin
  • CPU组
    Qualcomm Snapdragon 808/810 left arrow HiSilicon Kirin 960
  • 分段
    Mobile left arrow Mobile
  • 一代人
    2 left arrow 5
CPU技术规格

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

  • 核心架构
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
  • 頻率
    1.50 GHz left arrow 1.80 GHz
  • 涡轮增压 (1核)
    2.00 GHz left arrow 2.40 GHz
  • Turbo (8 Cores)
    2.00 GHz left arrow 2.40 GHz
  • 超线程
    没有 left arrow 没有
  • 超频
    没有 left arrow 没有
IGPU

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

  • GPU名称
    Qualcomm Adreno 430 left arrow ARM Mali-G71 MP8
  • GPU frequency
    0.60 GHz left arrow 0.90 GHz
  • GPU (Turbo)
    0.60 GHz left arrow 没有涡轮增压
  • 执行单位
    0 left arrow 8
  • 着色器
    256 left arrow 256
  • Max. GPU Memory
    -- left arrow 2 GB
  • Max. displays
    0 left arrow 2
  • 一代人
    4 left arrow Bifrost 1
  • 技术过程
    20 nm left arrow 16 nm
  • 发布日期
    Q2/2014 left arrow Q2/2016
硬件编解码器支持

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

  • h265 / HEVC (8 bit)
    Decode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    没有 left arrow Decode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP8
    没有 left arrow Decode / Encode
  • VP9
    没有 left arrow 没有
  • AV1
    没有 left arrow 没有
  • AVC
    没有 left arrow Decode / Encode
  • VC-1
    Decode left arrow 没有
  • JPEG
    Decode / Encode left arrow Decode / Encode
内存规格和PCI

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 和 Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

  • 存储器类型
    LPDDR4-1600 left arrow LPDDR4-1600
  • 最大内存
    left arrow 6 GB
  • 记忆通道
    2 left arrow 2
  • ECC
    没有 left arrow 没有
能源消耗

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 和 HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

  • TDP (PL1)
    left arrow 5 W
技术和扩展

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 和 HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

  • 指令集(ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • L2-Cache
    -- left arrow 4.00 MB
  • 建筑学
    Cortex-A57 / Cortex-A53 left arrow Cortex-A73 / Cortex-A53
  • 技术过程
    20 nm left arrow 16 nm
  • 虚拟化
    None left arrow None
  • 插座
    N/A left arrow N/A
  • 发布日期
    Q3/2014 left arrow Q4/2016
  • Part Number
    MSM8994 left arrow --

基准

性能测试 CPUs

By analyzing the results from various benchmarks, you can gain a clearer understanding of the performance differences between Qualcomm Snapdragon 810 和 HiSilicon Kirin 960.

Compare the synthetic benchmark scores and make an informed decision on the best processor for your needs!

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC是一个流行的跨平台性能测试,适用于密集使用系统内存的桌面或移动处理器。
231
Qualcomm Snapdragon 810
381
HiSilicon Kirin 960
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC是一个流行的跨平台性能测试,适用于密集使用系统内存的桌面或移动处理器。
697
Qualcomm Snapdragon 810
1491
HiSilicon Kirin 960
iGPU - FP32 Performance (Single-precision GFLOPS)
iGPU的性能--游戏中的内部GPU
389
Qualcomm Snapdragon 810
245
HiSilicon Kirin 960

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