Qualcomm Snapdragon 810 vs HiSilicon Kirin 960. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Qualcomm Snapdragon HiSilicon Kirin
• CPU 그룹
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• 세그먼트
  Mobile Mobile
• 세대
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 빈도
  1.50 GHz 1.80 GHz
• Turbo (1 Core)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz 터보 없음
• 실행 단위
  0 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 2
• 세대
  4 Bifrost 1
• 기술
  20 nm 16 nm
• 릴리스 날짜
  Q2/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  아니요 Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  아니요 Decode / Encode
• VP9
  아니요 아니요
• AV1
  아니요 아니요
• AVC
  아니요 Decode / Encode
• VC-1
  Decode 아니요
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 그리고 Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4-1600 LPDDR4-1600
• 최대. Memory
  6 GB
• 메모리 채널
  2 2
• ECC
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 그리고 HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 그리고 HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• 아키텍처
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• 기술
  20 nm 16 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --