Qualcomm Snapdragon 810 gegen HiSilicon Kirin 960. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon HiSilicon Kirin
• CPU Gruppe
  Qualcomm Snapdragon 808/810 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Generation
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenz
  1.50 GHz 1.80 GHz
• Turbo (1 Kern)
  2.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 430 ARM Mali-G71 MP8
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz kein Turbo
• Ausführungseinheiten
  0 8
• Shader
  256 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 2
• Generation
  4 Bifrost 1
• technisches verfahren
  20 nm 16 nm
• Datum der Veröffentlichung
  Q2/2014 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 und Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4-1600 LPDDR4-1600
• Max. Speicher
  6 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 und HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 und HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  -- 4.00 MB
• Architektur
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• technisches verfahren
  20 nm 16 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2014 Q4/2016
• Part Number
  MSM8994 --