HiSilicon Kirin 960 kontra HiSilicon Kirin 650. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin HiSilicon Kirin
• Pokolenie
  5 4
• Grupa CPU
  HiSilicon Kirin 960 HiSilicon Kirin 650

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.80 GHz 1.70 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.40 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.40 GHz 2.00 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Cortex-A53
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G71 MP8 ARM Mali-T830 MP2
• GPU frequency
  0.90 GHz 0.90 GHz
• GPU (Turbo)
  No turbo 0.90 GHz
• Jednostki wykonawcze
  8 2
• Shader
  256 32
• Max. GPU Memory
  2 GB --
• Max. displays
  2 2
• Pokolenie
  Bifrost 1 Midgard 4
• DirectX Version
  11 11
• Proces technologiczny
  16 nm 28nm
• Data wydania
  Q2/2016 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode / Encode Nie
• VC-1
  Nie Nie
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 650 oraz HiSilicon Kirin 960. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4-1600 LPDDR3-933
• Max. Pamięć
  6 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 960 oraz HiSilicon Kirin 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 960 oraz HiSilicon Kirin 650, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L3-Cache
  4.00 MB --
• Architektura
  Cortex-A73 / Cortex-A53 Cortex-A53 / Cortex-A53
• Proces technologiczny
  16 nm 16 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q4/2016 Q2/2016