Qualcomm Snapdragon 636 kontra MediaTek Helio P70. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Mediatek Helio
• Pokolenie
  5 3
• Grupa CPU
  Qualcomm Snapdragon 636 MediaTek Helio P60/P70

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 509 ARM Mali-G72 MP3
• GPU frequency
  0.72 GHz 0.90 GHz
• GPU (Turbo)
  0.72 GHz No turbo
• Jednostki wykonawcze
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 3
• Shader
  128 48
• Max. GPU Memory
  -- 2 GB
• Max. displays
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 1
• Pokolenie
  5 Bifrost 2
• Proces technologiczny
  14 nm 16 nm
• Data wydania
  Q2/2017 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio P70 oraz Qualcomm Snapdragon 636. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4-1333 LPDDR4X-1800
• Max. Pamięć
  8 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 636 oraz MediaTek Helio P70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 636 oraz MediaTek Helio P70, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Kryo 260 Cortex-A73 / Cortex-A53
• Proces technologiczny
  14 nm 12 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q4/2017 Q2/2020
• Part Number
  SDM636 --