Qualcomm Snapdragon 636 contre MediaTek Helio P70. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon Mediatek Helio
• Génération
  5 3
• Groupe de CPU
  Qualcomm Snapdragon 636 MediaTek Helio P60/P70

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 509 ARM Mali-G72 MP3
• GPU frequency
  0.72 GHz 0.90 GHz
• GPU (Turbo)
  0.72 GHz Pas de turbo
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 3
• Shader
  128 48
• Max. GPU Memory
  -- 2 GB
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 1
• Génération
  5 Bifrost 2
• Processus technologique
  14 nm 16 nm
• Date de sortie
  Q2/2017 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Non Non
• AVC
  Non Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio P70 et Qualcomm Snapdragon 636. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4-1333 LPDDR4X-1800
• Max. Mémoire
  8 GB
• ECC
  Non Non
• Canaux de mémoire
  2 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 636 et MediaTek Helio P70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 636 et MediaTek Helio P70, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Kryo 260 Cortex-A73 / Cortex-A53
• Processus technologique
  14 nm 12 nm
• Socket
  N/A N/A
• Date de sortie
  Q4/2017 Q2/2020
• Part Number
  SDM636 --