Qualcomm Snapdragon 636
MediaTek Helio P70
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Qualcomm Snapdragon 636 对 MediaTek Helio P70. 规格、性能、测试

总分
star star star star star
已发布
Q4/2017
Qualcomm Snapdragon 636
Qualcomm Snapdragon 636
已发布
Q2/2020
总分
star star star star star
MediaTek Helio P70
MediaTek Helio P70

比较 Qualcomm Snapdragon 636 VS MediaTek Helio P70. Which processor delivers superior performance?

In this detailed comparison, we evaluate the specifications and benchmarks of both processors to determine the best choice for your needs. We analyze their core counts, maximum frequencies, and power consumption.

Qualcomm Snapdragon 636 boasts a maximum frequency of 1.60 GHz GHz. 8 cores that enhance multitasking capabilities.发布于 Q4/2017, it incorporates the latest technology for optimal efficiency.

MediaTek Helio P70 features a maximum frequency of 1.90 GHz GHz. 8 / 8 cores designed for high-performance tasks.Launched in Q2/2020, it is built to handle demanding applications.

差异

  • 在总排名中的位置

    (基于几个基准)

    1641 left arrow score

所有排名中的位置

共同立场 Qualcomm Snapdragon 636 在流行的基准测试中的CPU,用于与其他型号进行比较.

  • Geekbench 5, 64bit (Single-Core)
    1382 place
  • Geekbench 5, 64bit (Multi-Core)
    1271 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1375 place
  • AnTuTu 8 benchmark
    91 place
  • 在总排名中的位置

    (基于几个基准)

    1655 left arrow score
  • 更高的时钟速度

    左右 16% 更好的时钟速度

    1.90 GHz left arrow 1.60 GHz

所有排名中的位置

共同立场 MediaTek Helio P70 在流行的基准测试中的CPU,用于与其他型号进行比较.

  • Geekbench 5, 64bit (Single-Core)
    1365 place
  • Geekbench 5, 64bit (Multi-Core)
    1157 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1581 place
  • AnTuTu 8 benchmark
    79 place

规格

技术数据
Qualcomm Snapdragon 636 Qualcomm Snapdragon 636
MediaTek Helio P70 MediaTek Helio P70
CPU家族和团体

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

  • 分段
    Mobile left arrow Mobile
  • 系列
    Qualcomm Snapdragon left arrow Mediatek Helio
  • 一代人
    5 left arrow 3
  • CPU组
    Qualcomm Snapdragon 636 left arrow MediaTek Helio P60/P70
CPU技术规格

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

  • 超频
    没有 left arrow 没有
  • 核心架构
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
IGPU

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

  • GPU名称
    Qualcomm Adreno 509 left arrow ARM Mali-G72 MP3
  • GPU frequency
    0.72 GHz left arrow 0.90 GHz
  • GPU (Turbo)
    0.72 GHz left arrow 没有涡轮增压
  • 执行单位
    0 left arrow 3
  • 着色器
    128 left arrow 48
  • Max. GPU Memory
    -- left arrow 2 GB
  • Max. displays
    0 left arrow 1
  • 一代人
    5 left arrow Bifrost 2
  • 技术过程
    14 nm left arrow 16 nm
  • 发布日期
    Q2/2017 left arrow Q3/2017
硬件编解码器支持

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

  • h265 / HEVC (8 bit)
    Decode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    没有 left arrow Decode / Encode
  • h264
    Decode left arrow Decode / Encode
  • VP9
    Decode left arrow Decode / Encode
  • VP8
    Decode left arrow Decode / Encode
  • AV1
    没有 left arrow 没有
  • AVC
    没有 left arrow Decode / Encode
  • VC-1
    Decode left arrow Decode / Encode
  • JPEG
    Decode left arrow Decode / Encode
内存规格和PCI

Overview of the types and quantities of RAM supported by MediaTek Helio P70 和 Qualcomm Snapdragon 636. The supported memory frequencies may vary depending on the motherboard configuration.

  • 存储器类型
    LPDDR4-1333 left arrow LPDDR4X-1800
  • 最大内存
    left arrow 8 GB
  • ECC
    没有 left arrow 没有
  • 记忆通道
    2 left arrow 2
能源消耗

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 636 和 MediaTek Helio P70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

技术和扩展

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 636 和 MediaTek Helio P70, including virtual machine technologies and fabrication processes.

  • 指令集(ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • 虚拟化
    None left arrow None
  • 建筑学
    Kryo 260 left arrow Cortex-A73 / Cortex-A53
  • 技术过程
    14 nm left arrow 12 nm
  • 插座
    N/A left arrow N/A
  • 发布日期
    Q4/2017 left arrow Q2/2020
  • Part Number
    SDM636 left arrow --

基准

性能测试 CPUs

By analyzing the results from various benchmarks, you can gain a clearer understanding of the performance differences between Qualcomm Snapdragon 636 和 MediaTek Helio P70.

Compare the synthetic benchmark scores and make an informed decision on the best processor for your needs!

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC是一个流行的跨平台性能测试,适用于密集使用系统内存的桌面或移动处理器。
268
Qualcomm Snapdragon 636
293
MediaTek Helio P70
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC是一个流行的跨平台性能测试,适用于密集使用系统内存的桌面或移动处理器。
1137
Qualcomm Snapdragon 636
1371
MediaTek Helio P70
iGPU - FP32 Performance (Single-precision GFLOPS)
iGPU的性能--游戏中的内部GPU
184
Qualcomm Snapdragon 636
100
MediaTek Helio P70

最新比较