Qualcomm Snapdragon 636 gegen MediaTek Helio P70. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Mediatek Helio
• Generation
  5 3
• CPU Gruppe
  Qualcomm Snapdragon 636 MediaTek Helio P60/P70

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 509 ARM Mali-G72 MP3
• GPU frequency
  0.72 GHz 0.90 GHz
• GPU (Turbo)
  0.72 GHz kein Turbo
• Ausführungseinheiten
  0 3
• Shader
  128 48
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 1
• Generation
  5 Bifrost 2
• technisches verfahren
  14 nm 16 nm
• Datum der Veröffentlichung
  Q2/2017 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio P70 und Qualcomm Snapdragon 636. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4-1333 LPDDR4X-1800
• Max. Speicher
  8 GB
• ECC
  Nein Nein
• Speicherkanäle
  2 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 636 und MediaTek Helio P70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 636 und MediaTek Helio P70, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Kryo 260 Cortex-A73 / Cortex-A53
• technisches verfahren
  14 nm 12 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2017 Q2/2020
• Part Number
  SDM636 --