Qualcomm Snapdragon 630 kontra Qualcomm Snapdragon 636. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Pokolenie
  5 5
• Grupa CPU
  Qualcomm Snapdragon 630 Qualcomm Snapdragon 636

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.80 GHz 1.60 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.20 GHz 1.80 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.60 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 4x Kryo 260 Gold
• B core
  4x Cortex-A53 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 508 Qualcomm Adreno 509
• GPU frequency
  0.65 GHz 0.72 GHz
• GPU (Turbo)
  0.65 GHz 0.72 GHz
• Shader
  128 128
• Pokolenie
  5 5
• DirectX Version
  12.1 12.1
• Proces technologiczny
  14 nm 14 nm
• Data wydania
  Q2/2017 Q2/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode Decode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Decode Decode
• JPEG
  Decode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 636 oraz Qualcomm Snapdragon 630. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4-1333 LPDDR4-1333
• ECC
  Nie Nie
• Kanały pamięci
  2 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 630 oraz Qualcomm Snapdragon 636 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 630 oraz Qualcomm Snapdragon 636, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Cortex-A53 Kryo 260
• Proces technologiczny
  14 nm 14 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2017 Q4/2017
• Part Number
  SDM630 SDM636