Qualcomm Snapdragon 210 kontra MediaTek Helio G25. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon Mediatek Helio
• Grupa CPU
  Qualcomm Snapdragon 205-212 MediaTek Helio G25/G35
• Segment
  Mobile Mobile
• Pokolenie
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Architektura podstawowa
  normal hybrid (big.LITTLE)
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 304 PowerVR GE8320
• GPU frequency
  0.40 GHz 0.65 GHz
• GPU (Turbo)
  0.40 GHz No turbo
• Jednostki wykonawcze
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 1
• Shader
  24 --
• Max. displays
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 1
• Pokolenie
  3 --
• Proces technologiczny
  28 nm 20 nm
• Data wydania
  Q3/2015 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Nie
• VP8
  Nie Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Decode Nie
• JPEG
  Decode / Encode Nie

Overview of the types and quantities of RAM supported by MediaTek Helio G25 oraz Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR2LPDDR3 LPDDR3-933LPDDR4X-1600
• Max. Pamięć
  6 GB
• Kanały pamięci
  1 1
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 oraz MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 oraz MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Rozszerzenia ISA
  --
• Architektura
  Cortex-A7 Cortex-A53 / Cortex-A53
• Proces technologiczny
  28 nm 12 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  2014 Q2/2020
• Part Number
  MSM8909 MT6762G