Qualcomm Snapdragon 210 gegen MediaTek Helio G25. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• CPU Gruppe
  Qualcomm Snapdragon 205-212 MediaTek Helio G25/G35
• Segment
  Mobile Mobile
• Generation
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Zentrale Architektur
  normal hybrid (big.LITTLE)
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 304 PowerVR GE8320
• GPU frequency
  0.40 GHz 0.65 GHz
• GPU (Turbo)
  0.40 GHz kein Turbo
• Ausführungseinheiten
  0 1
• Shader
  24 --
• Max. displays
  0 1
• Generation
  3 --
• technisches verfahren
  28 nm 20 nm
• Datum der Veröffentlichung
  Q3/2015 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode / Encode Nein
• VP8
  Nein Nein
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by MediaTek Helio G25 und Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR2LPDDR3 LPDDR3-933LPDDR4X-1600
• Max. Speicher
  6 GB
• Speicherkanäle
  1 1
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 und MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 und MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  --
• Architektur
  Cortex-A7 Cortex-A53 / Cortex-A53
• technisches verfahren
  28 nm 12 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  2014 Q2/2020
• Part Number
  MSM8909 MT6762G