Qualcomm Snapdragon 210 contra MediaTek Helio G25. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• Grupo CPU
  Qualcomm Snapdragon 205-212 MediaTek Helio G25/G35
• Segmento
  Mobile Mobile
• Generación
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Arquitectura del núcleo
  normal hybrid (big.LITTLE)
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 304 PowerVR GE8320
• GPU frequency
  0.40 GHz 0.65 GHz
• GPU (Turbo)
  0.40 GHz sin turbo
• Unidades de ejecución
  0 1
• Shader
  24 --
• Max. displays
  0 1
• Generación
  3 --
• Proceso técnico
  28 nm 20 nm
• Fecha de publicación
  Q3/2015 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by MediaTek Helio G25 y Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR2LPDDR3 LPDDR3-933LPDDR4X-1600
• Max. Memoria
  6 GB
• Canales de memoria
  1 1
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 y MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 y MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Extensiones ISA
  --
• Arquitectura
  Cortex-A7 Cortex-A53 / Cortex-A53
• Proceso técnico
  28 nm 12 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  2014 Q2/2020
• Part Number
  MSM8909 MT6762G