Qualcomm Snapdragon 210 vs MediaTek Helio G25. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Qualcomm Snapdragon Mediatek Helio
• CPU group
  Qualcomm Snapdragon 205-212 MediaTek Helio G25/G35
• Segment
  Mobile Mobile
• Generation
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• Core architecture
  normal hybrid (big.LITTLE)
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 304 PowerVR GE8320
• GPU frequency
  0.40 GHz 0.65 GHz
• GPU (Turbo)
  0.40 GHz No turbo
• Execution units
  0 1
• Shader
  24 --
• Max. displays
  0 1
• Generation
  3 --
• Technology
  28 nm 20 nm
• Release date
  Q3/2015 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by MediaTek Helio G25 and Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR2LPDDR3 LPDDR3-933LPDDR4X-1600
• Max. Memory
  6 GB
• Memory channels
  1 1
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 and MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 and MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Architecture
  Cortex-A7 Cortex-A53 / Cortex-A53
• Technology
  28 nm 12 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  2014 Q2/2020
• Part Number
  MSM8909 MT6762G