HiSilicon Kirin 710
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Q3/2018
HiSilicon Kirin 710

Procesador HiSilicon Kirin 710, especificaciones y puntos de referencia

1625 ¡lugar en la clasificación general de CPUs!
El procesador HiSilicon Kirin 710 se instala en placas con socket N/A y funciona a una frecuencia de 1.70 GHz. El HiSilicon Kirin 710 tiene un total de 8 núcleos. Fecha de lanzamiento: Q3/2018. TDP es 5 W. Esta revisión proporciona todas las especificaciones técnicas y los datos detallados sobre el procesador HiSilicon Kirin 710. Descubre todo para saber si un juego o software funcionará en el HiSilicon Kirin 710.

Especificaciones

Datos técnicos
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segmento
    Mobile
  • Serie
  • Generación
    5
  • Grupo CPU
    HiSilicon Kirin 710
  • Modelo anterior
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 710. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frecuencia
    1.70 GHz
  • Núcleos de CPU
    8
  • Turbo (1 núcleo)
    2.20 GHz
  • Hilos de la CPU
    8
  • Turbo (8 Cores)
    2.20 GHz
  • Hyperthreading
    No
  • Overclocking
    No
  • Arquitectura del núcleo
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A73
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nombre de la GPU
    ARM Mali-G51 MP4
  • GPU frequency
    0.65 GHz
  • GPU (Turbo)
    1.00 GHz
  • Unidades de ejecución
    8
  • Shader
    128
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Generación
    Bifrost 1
  • DirectX Version
    11
  • Proceso técnico
    12 nm
  • Fecha de publicación
    Q2/2018
Compatibilidad con códecs de hardware

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    No
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    No
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Tipo de memoria
    LPDDR3LPDDR4
  • Max. Memoria
    6 GB
  • ECC
    No
  • Canales de memoria
    2
  • Versión PCIe
  • Carriles PCIe
Cifrado

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    No
Consumo de energía
  • TDP (PL1)
    5 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura máxima
    --
* ver más abajo
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Juego de instrucciones (ISA)
    ARMv8-A64 (64 bit)
  • Virtualización
    None
  • Extensiones ISA
  • L2-Cache
    --
  • L3-Cache
    1.00 MB
  • Arquitectura
    Cortex-A73 / Cortex-A53
  • Proceso técnico
    12 nm
  • Enchufe
    N/A
  • Fecha de publicación
    Q3/2018
  • Part Number
    --
Posiciones en todas las clasificaciones

Posiciones comunes HiSilicon Kirin 710 CPU en pruebas de referencia populares, para comparar con otros modelos.

  • Geekbench 5, 64bit (Single-Core)
    1335 place
  • Geekbench 5, 64bit (Multi-Core)
    1205 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1423 place
  • AnTuTu 8 benchmark
    73 place

Puntos de referencia

Pruebas de rendimiento CPU

Compare the benchmark scores of HiSilicon Kirin 710 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC es una popular prueba de rendimiento multiplataforma para procesadores de ordenadores de sobremesa o móviles que utiliza intensamente la memoria del sistema.
327
324
324
322
HiSilicon Kirin 710
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC es una popular prueba de rendimiento multiplataforma para procesadores de ordenadores de sobremesa o móviles que utiliza intensamente la memoria del sistema.
1287
1275
1271
1270
HiSilicon Kirin 710
iGPU - FP32 Performance (Single-precision GFLOPS)
El rendimiento de la iGPU - la GPU interna en los juegos.
168
168
168
166
HiSilicon Kirin 710

Sinónimos

Procesadores similares en términos de rendimiento.

Similar en los procesadores de datos técnicos con HiSilicon Kirin 710.

AMD A4-3300 Ver
Intel Pentium N3530 Ver
Qualcomm Snapdragon 429 Ver
Intel Celeron N3150 Ver
AMD A8-5545M Ver
Qualcomm Snapdragon 660 Ver
Intel Pentium Gold 5405U Ver
Qualcomm Snapdragon 660 non LTE Ver

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 710

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