HiSilicon Kirin 710 contra Qualcomm Snapdragon 665. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generación
  5 7
• Grupo CPU
  HiSilicon Kirin 710 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.70 GHz 1.80 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.20 GHz 2.00 GHz
• Hilos de la CPU
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Kryo 260 Gold
• B core
  4x Cortex-A53 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G51 MP4 Qualcomm Adreno 610
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  1.00 GHz sin turbo
• Unidades de ejecución
  8 0
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 0
• Generación
  Bifrost 1 6
• DirectX Version
  11 12.1
• Proceso técnico
  12 nm 11 nm
• Fecha de publicación
  Q2/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 665 y HiSilicon Kirin 710. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3LPDDR4 LPDDR3-1866LPDDR4X-1866
• Max. Memoria
  6 GB
• ECC
  No No
• Canales de memoria
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 710 y Qualcomm Snapdragon 665 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 710 y Qualcomm Snapdragon 665, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• L3-Cache
  1.00 MB --
• Arquitectura
  Cortex-A73 / Cortex-A53 Kryo 260
• Proceso técnico
  12 nm 11 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2018 Q2/2019
• Part Number
  -- SM6125