HiSilicon Kirin 710
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Q3/2018
HiSilicon Kirin 710

Prozessor HiSilicon Kirin 710, Spezifikationen und Benchmarks

1625 Platz in der Gesamtwertung CPUs!
Der HiSilicon Kirin 710 Prozessor wird in N/A Sockel-Platinen installiert und arbeitet mit einer Frequenz von 1.70 GHz. Der HiSilicon Kirin 710 hat insgesamt 8 Kerne. Erscheinungsdatum: Q3/2018. TDP beträgt 5 W. Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum HiSilicon Kirin 710 Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf HiSilicon Kirin 710 laufen.

Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Serie
  • Generation
    5
  • CPU Gruppe
    HiSilicon Kirin 710
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 710. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequenz
    1.70 GHz
  • CPU Kerne
    8
  • Turbo (1 Kern)
    2.20 GHz
  • CPU Threads
    8
  • Turbo (8 Cores)
    2.20 GHz
  • Hyperthreading
    Nein
  • Übertaktung
    Nein
  • Zentrale Architektur
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A73
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    ARM Mali-G51 MP4
  • GPU frequency
    0.65 GHz
  • GPU (Turbo)
    1.00 GHz
  • Ausführungseinheiten
    8
  • Shader
    128
  • Max. GPU Memory
    4 GB
  • Max. displays
    2
  • Generation
    Bifrost 1
  • DirectX Version
    11
  • technisches verfahren
    12 nm
  • Datum der Veröffentlichung
    Q2/2018
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Nein
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Nein
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    LPDDR3LPDDR4
  • Max. Speicher
    6 GB
  • ECC
    Nein
  • Speicherkanäle
    2
  • PCIe-Version
  • PCIe-Lanes
Verschlüsselung

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Nein
Energieverbrauch
  • TDP (PL1)
    5 W
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Maximale Temperatur
    --
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Befehlssatz (ISA)
    ARMv8-A64 (64 bit)
  • Virtualisierung
    None
  • ISA-Erweiterungen
  • L2-Cache
    --
  • L3-Cache
    1.00 MB
  • Architektur
    Cortex-A73 / Cortex-A53
  • technisches verfahren
    12 nm
  • Steckdose
    N/A
  • Datum der Veröffentlichung
    Q3/2018
  • Part Number
    --
Positionen in allen Ranglisten

Gemeinsame Standpunkte HiSilicon Kirin 710 CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

  • Geekbench 5, 64bit (Single-Core)
    1335 place
  • Geekbench 5, 64bit (Multi-Core)
    1205 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1423 place
  • AnTuTu 8 benchmark
    73 place

Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of HiSilicon Kirin 710 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC ist ein beliebter plattformübergreifender Leistungstest für Desktop- oder Mobilprozessoren, der den Systemspeicher intensiv nutzt.
327
324
324
322
HiSilicon Kirin 710
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC ist ein beliebter plattformübergreifender Leistungstest für Desktop- oder Mobilprozessoren, der den Systemspeicher intensiv nutzt.
1287
1275
1271
1270
HiSilicon Kirin 710
iGPU - FP32 Performance (Single-precision GFLOPS)
Die Leistung der iGPU - der internen GPU in Spielen.
168
168
168
166
HiSilicon Kirin 710

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit HiSilicon Kirin 710.

AMD A4-3300 Siehe
Intel Pentium N3530 Siehe
Qualcomm Snapdragon 429 Siehe
Intel Celeron N3150 Siehe
AMD A8-5545M Siehe
Qualcomm Snapdragon 660 Siehe
Intel Pentium Gold 5405U Siehe
Qualcomm Snapdragon 660 non LTE Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 710

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