Samsung Exynos 990 对 Qualcomm Snapdragon 888 Plus. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Samsung Exynos Qualcomm Snapdragon
• CPU组
  Samsung Exynos 990 Qualcomm Snapdragon 888
• 分段
  Mobile Mobile
• 一代人
  4 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• 頻率
  2.00 GHz 1.80 GHz
• 涡轮增压 (1核)
  2.73 GHz 3.00 GHz
• Turbo (8 Cores)
  2.73 GHz 2.42 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G77 MP11 Qualcomm Adreno 660
• GPU frequency
  0.80 GHz 0.84 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  11 0
• 着色器
  176 0
• Max. GPU Memory
  4 GB --
• Max. displays
  1 0
• 一代人
  Vallhall 1 6
• 技术过程
  7 nm 5 nm
• 发布日期
  Q2/2019 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode 没有
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 Plus 和 Samsung Exynos 990. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR5-2750 LPDDR5-3200
• 最大内存
  12 GB
• 记忆通道
  4 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 990 和 Qualcomm Snapdragon 888 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 990 和 Qualcomm Snapdragon 888 Plus, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  1.50 MB 4.00 MB
• L2-Cache
  2.00 MB 4.00 MB
• 建筑学
  Exynos M5/Cortex-A76/-A55 Kryo 680
• 技术过程
  7 nm 5 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q1/2020 Q3/2021
• Part Number
  -- SM8350-AC