Samsung Exynos 990 versus Qualcomm Snapdragon 888 Plus. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Samsung Exynos Qualcomm Snapdragon
• Grupo CPU
  Samsung Exynos 990 Qualcomm Snapdragon 888
• Segmento
  Mobile Mobile
• Geração
  4 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura central
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Frequência
  2.00 GHz 1.80 GHz
• Turbo (1 núcleo)
  2.73 GHz 3.00 GHz
• Turbo (8 Cores)
  2.73 GHz 2.42 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G77 MP11 Qualcomm Adreno 660
• GPU frequency
  0.80 GHz 0.84 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  11 0
• Shader
  176 0
• Max. GPU Memory
  4 GB --
• Max. displays
  1 0
• Geração
  Vallhall 1 6
• Processo técnico
  7 nm 5 nm
• Data de lançamento
  Q2/2019 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Não
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 Plus e Samsung Exynos 990. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR5-2750 LPDDR5-3200
• Máx. Memória
  12 GB
• Canais de memória
  4 4
• ECC
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 990 e Qualcomm Snapdragon 888 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 990 e Qualcomm Snapdragon 888 Plus, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Кеш L2
  1.50 MB 4.00 MB
• Кеш L3
  2.00 MB 4.00 MB
• Arquitectura
  Exynos M5/Cortex-A76/-A55 Kryo 680
• Processo técnico
  7 nm 5 nm
• Virtualização
  None None
• Socket
  N/A N/A
• Data de lançamento
  Q1/2020 Q3/2021
• Part Number
  -- SM8350-AC