Samsung Exynos 990 対 Qualcomm Snapdragon 888 Plus. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Samsung Exynos Qualcomm Snapdragon
• CPUグループ
  Samsung Exynos 990 Qualcomm Snapdragon 888
• セグメント
  Mobile Mobile
• 世代
  4 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• 周波数
  2.00 GHz 1.80 GHz
• ターボ(1コア)
  2.73 GHz 3.00 GHz
• Turbo (8 Cores)
  2.73 GHz 2.42 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G77 MP11 Qualcomm Adreno 660
• GPU frequency
  0.80 GHz 0.84 GHz
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  11 0
• シェーダー
  176 0
• Max. GPU Memory
  4 GB --
• Max. displays
  1 0
• 世代
  Vallhall 1 6
• ぎじゅつてきなかだい
  7 nm 5 nm
• 発売日
  Q2/2019 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode いいえ
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 Plus と Samsung Exynos 990. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR5-2750 LPDDR5-3200
• マックス メモリ
  12 GB
• メモリーチャンネル
  4 4
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 990 と Qualcomm Snapdragon 888 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 990 と Qualcomm Snapdragon 888 Plus, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  1.50 MB 4.00 MB
• L3-Cache
  2.00 MB 4.00 MB
• 建築
  Exynos M5/Cortex-A76/-A55 Kryo 680
• ぎじゅつてきなかだい
  7 nm 5 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q1/2020 Q3/2021
• Part Number
  -- SM8350-AC