Samsung Exynos 990 gegen Qualcomm Snapdragon 888 Plus. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Samsung Exynos Qualcomm Snapdragon
• CPU Gruppe
  Samsung Exynos 990 Qualcomm Snapdragon 888
• Segment
  Mobile Mobile
• Generation
  4 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• Frequenz
  2.00 GHz 1.80 GHz
• Turbo (1 Kern)
  2.73 GHz 3.00 GHz
• Turbo (8 Cores)
  2.73 GHz 2.42 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G77 MP11 Qualcomm Adreno 660
• GPU frequency
  0.80 GHz 0.84 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  11 0
• Shader
  176 0
• Max. GPU Memory
  4 GB --
• Max. displays
  1 0
• Generation
  Vallhall 1 6
• technisches verfahren
  7 nm 5 nm
• Datum der Veröffentlichung
  Q2/2019 Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Nein
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 Plus und Samsung Exynos 990. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR5-2750 LPDDR5-3200
• Max. Speicher
  12 GB
• Speicherkanäle
  4 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 990 und Qualcomm Snapdragon 888 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 990 und Qualcomm Snapdragon 888 Plus, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  1.50 MB 4.00 MB
• L3-Cache
  2.00 MB 4.00 MB
• Architektur
  Exynos M5/Cortex-A76/-A55 Kryo 680
• technisches verfahren
  7 nm 5 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2020 Q3/2021
• Part Number
  -- SM8350-AC