Qualcomm Snapdragon 480 5G 对 HiSilicon Kirin 970. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Qualcomm Snapdragon HiSilicon Kirin
• 一代人
  6 6
• CPU组
  Qualcomm Snapdragon 480 HiSilicon Kirin 970

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.80 GHz 1.84 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  1.80 GHz 2.40 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.40 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  normal hybrid (big.LITTLE)
• A core
  2x Kryo 460 Gold 4x Cortex-A73
• B core
  6x Kryo 460 Silver 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 619 ARM Mali-G72 MP12
• GPU frequency
  0.95 GHz 0.75 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  0 12
• 着色器
  128 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• 一代人
  6 Bifrost 2
• DirectX Version
  12.1 12
• 技术过程
  8 nm 16 nm
• 发布日期
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 和 Qualcomm Snapdragon 480 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  8 GB
• ECC
  没有 没有
• 记忆通道
  1 4

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 480 5G 和 HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 480 5G 和 HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  -- 2.00 MB
• 建筑学
  Kryo 460 Cortex-A73 / Cortex-A53
• 技术过程
  8 nm 10 nm
• 插座
  N/A N/A
• 发布日期
  Q1/2021 Q3/2017
• Part Number
  SM4350 --