Qualcomm Snapdragon 480 5G vs HiSilicon Kirin 970. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Qualcomm Snapdragon HiSilicon Kirin
• 세대
  6 6
• CPU 그룹
  Qualcomm Snapdragon 480 HiSilicon Kirin 970

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.80 GHz 1.84 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  1.80 GHz 2.40 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.40 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  normal hybrid (big.LITTLE)
• A core
  2x Kryo 460 Gold 4x Cortex-A73
• B core
  6x Kryo 460 Silver 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 619 ARM Mali-G72 MP12
• GPU frequency
  0.95 GHz 0.75 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  0 12
• Shader
  128 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• 세대
  6 Bifrost 2
• DirectX Version
  12.1 12
• 기술
  8 nm 16 nm
• 릴리스 날짜
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  아니요 아니요
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 그리고 Qualcomm Snapdragon 480 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  8 GB
• ECC
  아니요 아니요
• 메모리 채널
  1 4

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 480 5G 그리고 HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 480 5G 그리고 HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• L3-Cache
  -- 2.00 MB
• 아키텍처
  Kryo 460 Cortex-A73 / Cortex-A53
• 기술
  8 nm 10 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2021 Q3/2017
• Part Number
  SM4350 --