Qualcomm Snapdragon 480 5G 対 HiSilicon Kirin 970. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon HiSilicon Kirin
• 世代
  6 6
• CPUグループ
  Qualcomm Snapdragon 480 HiSilicon Kirin 970

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.80 GHz 1.84 GHz
• CPUコア
  8 8
• ターボ(1コア)
  1.80 GHz 2.40 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.40 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  normal hybrid (big.LITTLE)
• A core
  2x Kryo 460 Gold 4x Cortex-A73
• B core
  6x Kryo 460 Silver 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 619 ARM Mali-G72 MP12
• GPU frequency
  0.95 GHz 0.75 GHz
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  0 12
• シェーダー
  128 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• 世代
  6 Bifrost 2
• DirectX Version
  12.1 12
• ぎじゅつてきなかだい
  8 nm 16 nm
• 発売日
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  いいえ いいえ
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 と Qualcomm Snapdragon 480 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-2133 LPDDR4X-2133
• マックス メモリ
  8 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  1 4

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 480 5G と HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 480 5G と HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• L3-Cache
  -- 2.00 MB
• 建築
  Kryo 460 Cortex-A73 / Cortex-A53
• ぎじゅつてきなかだい
  8 nm 10 nm
• ソケット
  N/A N/A
• 発売日
  Q1/2021 Q3/2017
• Part Number
  SM4350 --