Qualcomm Snapdragon 480 5G versus HiSilicon Kirin 970. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  Qualcomm Snapdragon HiSilicon Kirin
• Geração
  6 6
• Grupo CPU
  Qualcomm Snapdragon 480 HiSilicon Kirin 970

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.80 GHz 1.84 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  1.80 GHz 2.40 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  1.80 GHz 2.40 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  normal hybrid (big.LITTLE)
• A core
  2x Kryo 460 Gold 4x Cortex-A73
• B core
  6x Kryo 460 Silver 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Qualcomm Adreno 619 ARM Mali-G72 MP12
• GPU frequency
  0.95 GHz 0.75 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  0 12
• Shader
  128 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  2 1
• Geração
  6 Bifrost 2
• DirectX Version
  12.1 12
• Processo técnico
  8 nm 16 nm
• Data de lançamento
  Q2/2020 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Não Não
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 970 e Qualcomm Snapdragon 480 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-2133 LPDDR4X-2133
• Máx. Memória
  8 GB
• ECC
  Não Não
• Canais de memória
  1 4

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 480 5G e HiSilicon Kirin 970 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 480 5G e HiSilicon Kirin 970, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L3
  -- 2.00 MB
• Arquitectura
  Kryo 460 Cortex-A73 / Cortex-A53
• Processo técnico
  8 nm 10 nm
• Socket
  N/A N/A
• Data de lançamento
  Q1/2021 Q3/2017
• Part Number
  SM4350 --