Qualcomm Snapdragon 210 对 MediaTek Helio G85. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Mediatek Helio
• CPU组
  Qualcomm Snapdragon 205-212 MediaTek Helio G70/G80
• 分段
  Mobile Mobile
• 一代人
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  normal hybrid (big.LITTLE)
• 頻率
  1.10 GHz 1.80 GHz
• 涡轮增压 (1核)
  1.10 GHz 2.00 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 304 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz 没有涡轮增压
• 执行单位
  0 2
• 着色器
  24 32
• Max. displays
  0 2
• 一代人
  3 Bifrost 2
• 技术过程
  28 nm 16 nm
• 发布日期
  Q3/2015 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  没有 Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  没有 Decode / Encode
• VP9
  没有 Decode / Encode
• AV1
  没有 没有
• AVC
  没有 Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 和 Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR2LPDDR3 LPDDR4X-1800
• 最大内存
  8 GB
• 记忆通道
  1 2
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 和 MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 和 MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• ISA扩展
  --
• 建筑学
  Cortex-A7 Cortex-A75 / Cortex-A55
• 技术过程
  28 nm 12 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  2014 Q2/2020
• Part Number
  MSM8909 MT6769Z