Qualcomm Snapdragon 210 contre MediaTek Helio G85. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Mediatek Helio
• Groupe de CPU
  Qualcomm Snapdragon 205-212 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Génération
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  normal hybrid (big.LITTLE)
• Fréquence
  1.10 GHz 1.80 GHz
• Turbo (1 cœur)
  1.10 GHz 2.00 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 304 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz Pas de turbo
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Shader
  24 32
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  3 Bifrost 2
• Processus technologique
  28 nm 16 nm
• Date de sortie
  Q3/2015 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Non Decode / Encode
• VP9
  Non Decode / Encode
• AV1
  Non Non
• AVC
  Non Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 et Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR2LPDDR3 LPDDR4X-1800
• Max. Mémoire
  8 GB
• Canaux de mémoire
  1 2
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 et MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 et MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Extensions ISA
  --
• Architecture
  Cortex-A7 Cortex-A75 / Cortex-A55
• Processus technologique
  28 nm 12 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  2014 Q2/2020
• Part Number
  MSM8909 MT6769Z