Qualcomm Snapdragon 210 対 MediaTek Helio G85. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Mediatek Helio
• CPUグループ
  Qualcomm Snapdragon 205-212 MediaTek Helio G70/G80
• セグメント
  Mobile Mobile
• 世代
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  normal hybrid (big.LITTLE)
• 周波数
  1.10 GHz 1.80 GHz
• ターボ(1コア)
  1.10 GHz 2.00 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 304 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz ターボなし
• 実行部隊
  0 2
• シェーダー
  24 32
• Max. displays
  0 2
• 世代
  3 Bifrost 2
• ぎじゅつてきなかだい
  28 nm 16 nm
• 発売日
  Q3/2015 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  いいえ Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  いいえ Decode / Encode
• VP9
  いいえ Decode / Encode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 と Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR2LPDDR3 LPDDR4X-1800
• マックス メモリ
  8 GB
• メモリーチャンネル
  1 2
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 と MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 と MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• ISAエクステンション
  --
• 建築
  Cortex-A7 Cortex-A75 / Cortex-A55
• ぎじゅつてきなかだい
  28 nm 12 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  2014 Q2/2020
• Part Number
  MSM8909 MT6769Z