Qualcomm Snapdragon 210 gegen MediaTek Helio G85. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• CPU Gruppe
  Qualcomm Snapdragon 205-212 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Generation
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  normal hybrid (big.LITTLE)
• Frequenz
  1.10 GHz 1.80 GHz
• Turbo (1 Kern)
  1.10 GHz 2.00 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 304 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz kein Turbo
• Ausführungseinheiten
  0 2
• Shader
  24 32
• Max. displays
  0 2
• Generation
  3 Bifrost 2
• technisches verfahren
  28 nm 16 nm
• Datum der Veröffentlichung
  Q3/2015 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 und Qualcomm Snapdragon 210. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR2LPDDR3 LPDDR4X-1800
• Max. Speicher
  8 GB
• Speicherkanäle
  1 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 210 und MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 210 und MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  --
• Architektur
  Cortex-A7 Cortex-A75 / Cortex-A55
• technisches verfahren
  28 nm 12 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  2014 Q2/2020
• Part Number
  MSM8909 MT6769Z