Intel Xeon w7-2475X versus AMD Ryzen Embedded V3C18I. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Intel Xeon W AMD Ryzen Embedded V
• Grupo CPU
  Intel Xeon W-2400 AMD Ryzen Embedded V3000
• Segmento
  Desktop / Server Desktop / Server
• Geração
  12 3
• Modelo passado
  Intel Xeon W-2275 AMD Ryzen Embedded V2718

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  20 / 40 8 / 16
• Arquitectura central
  normal normal
• Núcleos
  20x 8x Zen 3
• Hyperthreading / SMT
  Sim Sim
• Overclocking
  Sim Não
• Frequência
  2.60 GHz 1.90 GHz
• Turbo Frequency (1 Core)
  4.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  sem iGPU sem iGPU
• GPU (Turbo)
  Sem turbo Sem turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Não Não
• h265 / HEVC (10 bit)
  Não Não
• h264
  Não Não
• VP8
  Não Não
• VP9
  Não Não
• AV1
  Não Não
• AVC
  Não Não
• VC-1
  Não Não
• JPEG
  Não Não

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C18I e Intel Xeon w7-2475X. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  DDR5-4800 DDR5-4800
• Máx. Memória
  2048 GB 64 GB
• Canais de memória
  4 (Quad Channel) 2 (Dual Channel)
• Bandwidth
  153.6 GB/s 76.8 GB/s
• ECC
  Sim Sim
• PCIe
  5.0 x 64 4.0 x 20
• AES-NI
  Sim Sim

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon w7-2475X e AMD Ryzen Embedded V3C18I to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  270 W 25 W
• TDP down
  -- 10 W
• Temperatura máxima
  94 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon w7-2475X e AMD Ryzen Embedded V3C18I, including virtual machine technologies and fabrication processes.

• Processo técnico
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Socket
  LGA 4677 FP7r2
• Кеш L2
  -- 4.00 MB
• Кеш L3
  37.50 MB 16.00 MB
• Arquitectura
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Virtualização
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM
• Conjunto de instruções (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Extensões ISA
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Data de lançamento
  Q1/2023 Q3/2022
• Release price
  1789 $ --
• Documentos
  Technical data sheet Technical data sheet