Intel Xeon w7-2475X kontra AMD Ryzen Embedded V3C18I. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Intel Xeon W AMD Ryzen Embedded V
• Grupa CPU
  Intel Xeon W-2400 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  12 3
• Model z przeszłości
  Intel Xeon W-2275 AMD Ryzen Embedded V2718

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  20 / 40 8 / 16
• Architektura podstawowa
  normal normal
• Rdzenie
  20x 8x Zen 3
• Hyperthreading / SMT
  Tak Tak
• Overclocking
  Tak Nie
• Częstotliwość
  2.60 GHz 1.90 GHz
• Turbo Frequency (1 Core)
  4.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU brak iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Nie Nie
• VP8
  Nie Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C18I oraz Intel Xeon w7-2475X. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR5-4800 DDR5-4800
• Max. Pamięć
  2048 GB 64 GB
• Kanały pamięci
  4 (Quad Channel) 2 (Dual Channel)
• Bandwidth
  153.6 GB/s 76.8 GB/s
• ECC
  Tak Tak
• PCIe
  5.0 x 64 4.0 x 20
• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon w7-2475X oraz AMD Ryzen Embedded V3C18I to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  270 W 25 W
• TDP down
  -- 10 W
• Temperatura maksymalna
  94 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon w7-2475X oraz AMD Ryzen Embedded V3C18I, including virtual machine technologies and fabrication processes.

• Proces technologiczny
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Gniazdo
  LGA 4677 FP7r2
• L2-Cache
  -- 4.00 MB
• L3-Cache
  37.50 MB 16.00 MB
• Architektura
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Wirtualizacja
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM
• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Data wydania
  Q1/2023 Q3/2022
• Release price
  1789 $ --
• specyfikacja
  Technical data sheet Technical data sheet