Intel Xeon w7-2475X vs AMD Ryzen Embedded V3C18I. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Intel Xeon W AMD Ryzen Embedded V
• CPU group
  Intel Xeon W-2400 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Generation
  12 3
• Predecessor
  Intel Xeon W-2275 AMD Ryzen Embedded V2718

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  20 / 40 8 / 16
• Core architecture
  normal normal
• Cores
  20x 8x Zen 3
• Hyperthreading / SMT
  Yes Yes
• Overclocking
  Yes No
• Frequency
  2.60 GHz 1.90 GHz
• Turbo Frequency (1 Core)
  4.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  no iGPU no iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C18I and Intel Xeon w7-2475X. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  DDR5-4800 DDR5-4800
• Max. Memory
  2048 GB 64 GB
• Memory channels
  4 (Quad Channel) 2 (Dual Channel)
• Bandwidth
  153.6 GB/s 76.8 GB/s
• ECC
  Yes Yes
• PCIe
  5.0 x 64 4.0 x 20
• AES-NI
  Yes Yes

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon w7-2475X and AMD Ryzen Embedded V3C18I to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  270 W 25 W
• TDP down
  -- 10 W
• Tjunction max.
  94 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon w7-2475X and AMD Ryzen Embedded V3C18I, including virtual machine technologies and fabrication processes.

• Technology
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Socket
  LGA 4677 FP7r2
• L2-Cache
  -- 4.00 MB
• L3-Cache
  37.50 MB 16.00 MB
• Architecture
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Virtualization
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM
• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Release date
  Q1/2023 Q3/2022
• Release price
  1789 $ --
• Documents
  Technical data sheet Technical data sheet